DMC TSC-40/IC Spezifikationen PDF herunterladen (Seite 17)

TSC-40/IC Product Specification

80 to 150 C (Package surface temperature)

260 C max.

10s max. (Primary + Secondary flow

passage duration)

Time

Temperature

11030s

17515 C

1 to 4 C/s

220 C or above, 60s max.

255 C or above, 10-16s max.

260 C max.

Time

Package’s surface temperature

8. Implementation Temperature Specification

1. Reflow method (Infrared reflow, air reflow)

Frequency: Three times or less

Temperature: The following device surface temperature profile is recommended.

Figure 1: Infrared reflow, air reflow temperature profile

2. Wave soldering method (Flow soldering, solder dip method)

Frequency: One time or less

Temperature: Following temperature profile is recommended (Set the optimal preheat temperature

according to the flux type)

Figure 2: Wave soldering temperature profile

3. Soldering iron (Manual soldering)

Soldering bit’s temperature: 370 C or lower

Soldering time: Five seconds or less/terminal

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DMC TSC-40/IC Spezifikationen Seite 17